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Поиск Datasheets |
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| 447FJ425Z108 |
EMI/RFI Non-Environmental Band-in-a-Can Backshell With Cable Clamp Strain-Relief |
Glenair, Inc. |
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447FJ425Z108 Datasheet
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Постоянная ссылка на эту страницу |
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447FJ425Z108 и другие |
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| Компонент | Описание | Производитель | PDF |
| 802-012-07ZM5-3EA |
Receptacles for PCB or Solder Cup |
Glenair, Inc. |
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LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Deuices Incorporated |
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| COP8SGC928L8 |
8-Bit CMOS ROM Based and OTP Microcontrollers with 8k to 32k Memory, Two Comparators and USART |
National Semiconductor |
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| C1206X824K4RAC |
Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations |
Kemet Corporation |
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| EP2C50A15T324C6ES |
Cyclone II Device Family |
Altera Corporation |
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