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AM41DL3208GB70I |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
SPANSION |
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AM41DL3208GB70I Datasheet
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Постоянная ссылка на эту страницу |
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AM41DL3208GB70I и другие |
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Компонент | Описание | Производитель | PDF |
0739446000 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits |
Molex Electronics Ltd. |
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0739431200 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, Solder Tail Closed End, 144 Circuits |
Molex Electronics Ltd. |
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2RS2T80T |
2.00mm RECEPTACLE STRIPS .079 [2.00] CENTERLINE |
Adam Technologies, Inc. |
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0739444017 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header |
Molex Electronics Ltd. |
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0739432000 |
2.54mm (.100") Pitch C-Grid^ Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 8.13mm (.320") Mating Pin Length, 0.38lm (15l") Gold (Au) Selective |
Molex Electronics Ltd. |
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